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Class 1 NP0 10/16/25/50/100 V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
FEATURES
* Ultra stable class 1 dielectric * Four standard sizes * High capacitance per unit volume * Supplied in tape on reel * For high frequency applications * Ni-barrier with 100 % tin terminations
APPLICATIONS
* Consumer electronics * Telecommunications
GENERAL SPECIFICATIONS
NOTE: Electrical characteristics values temperature at 20 1 C, pressure at 86 to 106 Kpa and humidity at 63 to 67 % unless otherwise stated Rated Voltage UR (DC): 10 V; 16 V; 25 V; 50 V; 100 V Capacitance Range: 1.0 pF to 0.039 F Tolerance on Capacitance: C 10 pF = 1 %; 2 %; 5 %; 10 % C < 10 pF = 0.1 pF; 0.5 pF; 0.25 pF
* Data processing Tolerance on Capacitance (cont): Q 30 pF = Q 1000 Q < 30 pF = Q 400 + 20C Temperature Coefficient: 30 ppm/ C Insulation Resistance after 120 seconds at UR (DC): 10 G minimum or 500 F minimum, whichever is less Climatic Category (IEC 68): 55/125/56
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DIMENSIONS in inches [millimeters]
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SIZE CODE 0402 L W T MAX. 0.022 [0.55] 0.035 [0.87] 0.053 [1.35] 0.069 [1.8] MB 0.010 + 0.002/- 0.004 [0.25 + 0.05/- 0.1] 0.015 0.006 [0.40 0.15] 0.020 0.008 [0.50 0.20] 0.025 0.008 [0.60 0.20]
0.040 0.002 0.020 0.002 [1.0 0.05] [0.5 0.05] 0.063 0.004 0.030 0.003 [1.6 0.10] [0.8 0.07] 0.080 0.006 0.050 0.004 [2.0 0.15] [1.25 0.10] 0.063 0.006 0.125 0.006 [1.6 0.15] [3.2 0.15] 0.063 0.008 [1.6 0.20]
T
W
0603
MB L
MB
0805
1206
ORDERING INFORMATION
VJ0402 SIZE CODE 0402 0603 0805 1206 A DIELECTRIC A = COG (NP0) 101 CAPACITANCE two significant digits followed by the number of zeros: 101 = 100 102 = 1000 152 = 1500 103 = 10000 J X Q VOLTAGE Q = 10 V J = 16 V X = 25 V A = 50 V B = 100 V C PACKAGING C = 7 inches reel/paper P = 13 inches reel/paper T = 7 inches reel/blister R = 13 inches reel/blister W1BC TECHNOLOGY TOLERANCE TERMINATION B = 0.1 pF C = 0.25 pF D = 0.50 pF F=1% G=2% J=5% K = 10 % X = Ni Barrier
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www.vishay.com 2 For technical questions contact MLCC@vishay.com Document Number 28501 Revision 18-Sep-03
DataSheet 4 U .com
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Class 1 NP0 10/16/25/50/100 V
Surface Mount Multilayer Chip Capacitors
Vishay BCcomponents
SELECTION CHART FOR 10/16/25/50 AND 100 V
DIELECTRIC EIA CAP CODE 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 NPO SIZE 0402 0603 0805 1206 VDC W 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 0.5 pF N N N N S S S S S A A A A A 1.0 N N N N S S S S S A A A A A 1.2 N N N N S S S S S A A A A A 1.5 N N N N S S S S S A A A A A B B B B B 1.8 N N N N S S S S S A A A A A B B B B B 2.2 N N N N S S S S S A A A A A B B B B B 2.7 N N N N S S S S S A A A A A B B B B B 3.3 N N N N S S S S S A A A A A B B B B B 3.9 N N N N S S S S S A A A A A B B B B B 4.7 N N N N S S S S S A A A A A B B B B B 5.6 N N N N S S S S S A A A A A B B B B B 6.8 N N N N S S S S S A A A A A B B B B B 8.2 N N N N S S S S S A A A A A B B B B B 10 pF N N N N S S S S S A A A A A B B B B B 12 N N N N S S S S S A A A A A B B B B B 15 N N N N S S S S S A A A A A B B B B B 18 N N N N S S S S S A A A A A B B B B B 22 N N N N S S S S S A A A A A B B B B B 27 N N N N S S S S S A A A A A B B B B B 33 N N N N S S S S S A A A A A B B B B B 39 N N N N S S S S S A A A A A B B B B B 47 N N N N S S S S S A A A A A B B B B B 56 N N N N S S S S S A A A A A B B B B B 68 N N N N S S S S S A A A A A B B B B B 82 N N N N S S S S S A A A A A B B B B B 100 pF N N N N S S S S S A A A A A B B B B B 120 N N N N S S .comA S S S A A A A B B B B B 150 N N N N S S S S S A A A A A B B B B B 180 N N N S S S S S A A A A A B B B B B 220 N N N S S S S S A A A A A B B B B B 270 N N S S S S S A A A A A B B B B B 330 N N S S S S S A A A A A B B B B B 390 N N S S S S S B B B B B B B B B B 470 N N S S S S S B B B B B B B B B B 560 S S S S S B B B B B B B B B B 680 S S S S B B B B B B B B B B 820 S S S S B B B B B B B B B B 1000 pF S S S S B B B B B B B B B B 1200 S S B B B B B B B B B B 1500 S S B B B B B B B B B B 1800 S S B B B B B B B B B B 2200 S S B B B B B B B B B B 2700 S S D D D D D B B B B B 3300 S S D D D D D B B B B B 3900 D D D D D B B B B B 4700 D D D B B B B B 5600 D D B B B B B 6800 D D C C C C C 8200 D D C C C C C 0.01 F D D D D D D 0.012 D D D D 0.015 D D 0.018 D D 0.022 D D 0.027 D D 0.033 D D 0.039 G G 0.047 0.056 0.068 0.082 0.1 F For technical questions contact MLCC@vishay.com www.vishay.com 3
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DataShee
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Document Number 28501 Revision 18-Sep-03
DataSheet 4 U .com
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Class 1 NP0 10/16/25/50/100 V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
PACKAGING QUANTITIES
THICKNESS CLASSIFICATION (mm) A= B= C= D= G= S= N= K= M= 0.6 0.1 0.8 0.1 0.95 0.1 1.25 0.1 1.60 0.2 0.8 0.07 0.50 0.05 2.00 0.2 2.5 0.30 AMOUNT PER REEL 0402 Paper 10 Kp/Reel 180 mm; 7 inch 0603 0805 Paper 4 Kp/Reel Paper 4 Kp/Reel Plastic 3 Kp/Reel Paper 4 Kp/Reel 1206 Paper 4 Kp/Reel Plastic 3 Kp/Reel Plastic 3 Kp/Reel Plastic 2 Kp/Reel -
PACKAGING QUANTITIES
THICKNESS CLASSIFICATION (mm) A= B= C= D= G= S= N= K= M= 0.6 0.1 0.8 0.1 0.95 0.1 1.25 0.1 1.60 0.2 0.8 0.07 0.50 0.05 2.00 0.2 2.5 0.30 AMOUNT PER REEL 0402 Paper 50 Kp/Reel 330 mm; 13 inch 0603 0805 Paper 15 Kp/Reel Paper 15 Kp/Reel Plastic 10 Kp/Reel Paper 15 Kp/Reel .com 1206 Paper 15 Kp/Reel Plastic 10 Kp/Reel Plastic 10 Kp/Reel -
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COVER TAPE (POLYESTER - ANTISTATIC) PROPERTIES OF COVER TAPE
PARAMETER Breaking force Elongation at break Surface resistance Softening point Thickness WIDTH 5.5 0.1 mm 10.7 N 63 % < 1010 /sq. 71 5 C 62 m
CARRIER TAPE (POLYCARBONATE) PROPERTIES OF CARRIER TAPE
PARAMETER Thickness Tensile strength at break Elongation at break Surface resistance WIDTH 8.1 0.2 mm 190 to 280 m > 60 N /mm2 100 to 150 % > 1012 /sq.
PAPER TAPE SPECIFICATIONS
P0 D0 P2
DIMENSIONS OF PAPER TAPE in millimeters
SYMBOL
E
F W B0
A0 P1
A0 B0 W E F D0 P0 P1 P2
PRODUCT SIZE CODE 0402 0603 0805 1206 SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL. 0.62 0.05 1.02 0.05 1.50 0.10 2.00 0.15 1.12 0.05 1.82 0.05 2.30 0.10 3.50 0.15 8.00 0.10 8.00 0.10 8.00 0.10 8.00 0.10 1.75 0.10 1.75 0.10 1.75 0.10 1.75 0.10 3.50 0.05 3.50 0.05 3.50 0.05 3.50 0.05 1.55 0.05 1.55 0.05 1.55 0.05 1.55 0.05 4.00 0.10 4.00 0.10 4.00 0.10 4.00 0.10 2.00 0.05 4.00 0.10 4.00 0.10 4.00 0.10 2.00 0.05 2.00 0.05 2.00 0.05 2.00 0.05
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www.vishay.com 4 For technical questions contact MLCC@vishay.com Document Number 28501 Revision 18-Sep-03
DataSheet 4 U .com
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Class 1 NP0 10/16/25/50/100 V
Surface Mount Multilayer Chip Capacitors Vishay BCcomponents
BLISTER TAPE SPECIFICATIONS DIMENSIONS OF BLISTER TAPE in millimeters
P0 D0 P2 E
DIMENSION A0 B0 W E F D0 D1 P0 P1 P2
F B0
W
A0 P1
D1 direction of unreeling
PRODUCT 0805 1206 < 1.55 < 2.00 < 2.45 < 3.60 8.00 8.00 1.75 1.75 3.50 3.50 1.50 1.50 1.00 1.00 4.00 4.00 4.00 4.00 2.00 2.00
TOLERANCE 0.20 0.10 0.05 + 0.10/ - 0 0.10 0.05 0.10 0.05
REEL SPECIFICATIONS
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DataShee
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A D C
B
REEL DIMENSIONS AND TAPE WIDTH in millimeters
180 mm; 7 inch A B C D 13.0 1.0 9.0 1.0 178.0 1.0 60.5 1.0 330 mm; 13 inch 13.0 0.5 9.0 0.5 330.0 1.0 100.0 1.0
METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS
For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and reflow soldering. An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with the chip size and with temperature fluctuations (> 100 C) Therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given.
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Document Number 28501 Revision 18-Sep-03 For technical questions contact MLCC@vishay.com www.vishay.com 5
DataSheet 4 U .com
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Class 1 NP0 10/16/25/50/100 V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
SOLDERING GRAPHS IR REFLOW WITH SnAgCu SOLDERING
300 300 Max temperature
IR REFLOW WITH SnPb SOLDER
T
(C) Max temperature 250 > 215C: 20 ~ 40 seconds
T
(C) 250
200
200 Sn-Ag-Cu solder paste
150
150 Min temperature Min temperature
100
100
Sn-Pb Eutectic solder paste
50
50
0 60 ~ 120 seconds 60 ~ 120 seconds 30 ~ 60 sec 60 ~ 120 seconds time
0 time 30 ~ 60 seconds 30 ~ 60 seconds 30 ~ 60 seconds
WAVE SOLDERING
300
REFLOW SOLDERING
300 10 s 260 C 245 C 215 C 10 s
10 s
T
(C) 250 235 C to 260 C second wave
T
(C) 250
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200
first wave
5 K/s 2 K/s
200 180 C 40 s
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150
200 K/s
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150
forced cooling
130 C
100 C to 130 C 100
100 2 K/s
50
2 K/s
50
0 0 50 100 150 200 t (s) 250
0 0 50 100 150 200 t (s) 250
RECOMMENDED DIMENSIONS OF SOLDER LANDS in millimeters
solder land / solder paste pattern preferred direction during wave soldering
D
G
solder resist pattern
occupied area
E C B A F
tracks
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www.vishay.com 6 For technical questions contact MLCC@vishay.com Document Number 28501 Revision 18-Sep-03
DataSheet 4 U .com
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Class 1 NP0 10/16/25/50/100 V
Surface Mount Multilayer Chip Capacitors
Vishay BCcomponents
REFLOW SOLDERING
SIZE CODE 0402 0603 0805 1206 FOOTPRINT DIMENSIONS in mm A 1.50 2.30 2.80 4.00 B 0.50 0.70 1.00 2.20 C 0.50 0.80 0.90 0.90 D 0.50 0.80 1.30 1.60 E 0.10 0.20 0.40 1.60 F 1.75 2.55 3.08 4.25 G 0.95 1.40 1.85 2.25 PROCESSING REMARKS PLACEMENT ACCURACY 0.15 0.25 0.25 0.25
IR or hot plate soldering
WAVE SOLDERING
SIZE CODE 0603 0805 1206 FOOTPRINT DIMENSIONS in mm A 2.40 3.20 4.80 B 1.00 1.40 2.30 C 0.70 0.90 1.25 D 0.80 1.30 1.70 E 0.20 0.36 1.25 F 3.10 4.10 5.90 G 1.90 2.50 3.20 PROPOSED NUMBER AND DIMENSIONS OF DUMMY TRACKS (mm) 1 x (0.2 x 0.8) 1 x (0.3 x 1.3) 3 x (0.25 x 1.7) PLACEMENT ACCURACY (mm) 0.10 0.15 0.25
TEST CONDITIONS IN STATIC SOLDER BATH
PARAMETER SOLDERABILITY 95 % covered with smooth and bright solder coating CECC requirement: 235 5 C for 2 0.5 seconds IEC requirement: 215 3 C for 3 0.3 seconds 260 5 C for 30 1 second DESCRIPTION
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RESISTANCE TO LEACHING 10 % of the metallization of the edges of the head face may be missing (inner electrodes are not visible) .com
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TESTS AND REQUIREMENTS TEST PROCEDURES AND REQUIREMENTS
TEST Visual and mechanical Capacitance C 1000 pF, 1.0 0.2 Vrms; f = 1 MHz 10 % C > 1000 pF, 1.0 0.2 Vrms; f = 1 kHz 10 % C 1000 pF, 1.0 0.2 Vrms; f = 1 MHz 10 % C > 1000 pF, 1.0 0.2 Vrms; f = 1 kHz 10 % 250 % of rated voltage for 1 to 5 seconds, charge and discharge current less than 50 mA at UR (DC) for maximum 120 seconds with no electrical load: - 55 to 125 C at Tamb = 25 C the middle part of the substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure shall be maintained for 5 1 second measurement after 24 2 hours at room temperature 230 5 C for 2 0.5 seconds; Solder: SN63A PROCEDURE REQUIREMENTS no visible damage dimensions in accordance with specification shall not exceed the limits given in the detailed specification 30 pF: Q 1000 < 30 pF: Q 400 + 20C
Q value
Dielectric strength Insulation resistance Temperature coefficient
no visible damage or flash-over during test 10 G minimum or 500F minimum, whichever is less 30 ppm/C no visible damage C/C: 5.0 maximum or 0.5 pF maximum, whichever is greater this capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test 95 % minimum coverage of entire metallized area
Bending test
Solderability
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Document Number 28501 Revision 18-Sep-03 For technical questions contact MLCC@vishay.com www.vishay.com 7
DataSheet 4 U .com
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Class 1 NP0 10/16/25/50/100 V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
TEST PROCEDURES AND REQUIREMENTS
TEST PROCEDURE 260 5 C for 10 1 second; Solder: SN63A; Measurement after 24 2 hours at room temperature Preheating: 120 to 150 C for 1 minute before immerse the capacitor in a eutectic solder. - 55 to 125 C; 5 cycles in the following sequence: - 55 C - 3/+ 0 for 30 3 minutes; Room temperature for 2 to 3 minutes; 125 C + 3/- 0 for 30 3 minutes; Room temperature for 2 to 3 minutes Measurement after 24 2 hours at room temperature REQUIREMENTS no visible damage C/C: 2.5 % maximum or 0.25 pF maximum, whichever is greater DF, Rins and dielectric strength to meet initial requirements no visible damage C/C: 2.5 % maximum or 0.25 pF maximum, whichever is greater DF, Rins and dielectric strength to meet initial requirements no visual damage C/C: 5.0 % maximum or 0.5 pF maximum, whichever is greater Q: 30 pF Q 350 10 pF C < 30 pF, Q 275 + 2.5C < 10 pF, Q 200 + 10C Rins: 1 G minimum or 50 F minimum, whichever is less no visual damage C/C: 7.5 % maximum or 0.75 pF maximum, whichever is greater Q: 30 pF, Q 200 C < 30 pF, Q 100 + 10/3C Rins: 500 M minimum or 25 F minimum, whichever is less Adhesive strength of termination Pressurizing force 5 N ( 0603) and 10 N (> 0603) Test time 10 1 second Frequency: 10 to 55 Hz/minute; Total amplitude: 1.5 mm Test time: 6 hours (2 hours each in 3 mutually perpendicular directions) no visible damage no visible damage or removal of the terminations Capacitance change and DF: to meet initial requirements no visual damage C/C: 3 % maximum or 0.3 pF maximum, whichever is greater Q: 30 pF, Q 350 10 pF C < 30 pF, Q 275 + 2.5C C < 10 pF, Q 200 + 10C Rins: 1 G minimum or 50 F minimum, whichever is less
Resistance to soldering heat
Temperature cycle
Humidity test (damp heat steady state)
40 2 C; 90 to 95 % RH for 500 + 24/- 0 hours UR applied; Measurement after 24 2 hours at room temperature
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Humidity load (damp heat)
40 2 C; 90 to 95 % RH for 500 + 24/- 0 hours UR applied; .com Measurement after 24 2 hours at room temperature
Vibration resistance
High temperature load (endurance)
Test temperature: 125 3 C; 200 % of rated voltage for 1000 + 24/- 0 hours; Measurement after 24 2 hours at room temperature
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www.vishay.com 8 For technical questions contact MLCC@vishay.com Document Number 28501 Revision 18-Sep-03
DataSheet 4 U .com


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